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AI-Powered Cooling Solutions

Our product line of Intelligent Fine-Grain Heat Routing (IFG-HR) devices are based on unique materials and state-of-the-art deep neural networks trained through Reinforcement Learning (RL) on customer-specific simulation environments.

The animation to the right illustrates the process of training a IFG-HR device on a grid of hot spots. The environment used for the RL can be configured to represent arbitrary granularity, topologies and stacking configurations. 


The key innovation of IFG-HR is the capability to simultaneously sense and respond through a thin-film material known as a Thermal Transfer Layer (TTL). The TTL serves as the "eyes" of the algorithm, and simultaneously transfers heat away from a heat source at over 3000 W/mK - the highest known thermal conductivity of any material.


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Bleeding-Edge Intelligence Applied to Humanity's Oldest Problem

Dual-Layer IFG-HT Device - CPU Cooler
Tri-Layer IFG-HT Device - CPU Cooler
Quad-Layer IFG-HT Device - CPU Cooler
These are prototype not available for direct purchase at this time. Customers are encouraged to . Configurations are highly dependent on application. Opportunities for NRE-backed co-design opportunities exist. Reach out via our contact page if interested.

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  • Home
  • About Us
    • About
  • Contact
  • Products
    • Thermal Compounds
    • Dissipative Coatings
  • test