Cooling at the speed of light
Maxwell Labs Closes $1M Seed Round
Maxwell Labs has successfully closed its 2022 round for $1M in Seed Funding. The funding extends runway into 2023, and has allowed for two new Lead Scientists to join our team full-time. We're looking forward to an exciting year ahead as we bring our first generation radiative heatsink to market, and integrate the next-generation of thermal compounds and coatings into high-performance computing centers around the globe.
Special thanks to Arosa Capital, Monozukuri Ventures, Topping Capital, and mHUB's Product Impact Fund for their support!
Special thanks to Arosa Capital, Monozukuri Ventures, Topping Capital, and mHUB's Product Impact Fund for their support!
mHUB Community Pitch Event
Maxwell Labs will be presenting at mHUB's Industry 4.0 IoT Demo Day, taking place on November 17th, 2021!
Join us at mHUB in Chicago for a look at what we've been working on as we advance the cooling capabilities of high performance computing systems. In addition to our live demo, we will be joining 8 other amazing IIoT startups in presenting our vision for the future of this exciting frontier to the mHUB community!
If you are interested in attending the event virtually, reach out to invest@maxwell-labs.com for more information.
Join us at mHUB in Chicago for a look at what we've been working on as we advance the cooling capabilities of high performance computing systems. In addition to our live demo, we will be joining 8 other amazing IIoT startups in presenting our vision for the future of this exciting frontier to the mHUB community!
If you are interested in attending the event virtually, reach out to invest@maxwell-labs.com for more information.
Maxwell Labs Selected as Top Innovator @ Venture Summit 2021
Maxwell Labs has been selected to be featured as one of the Top Innovators on the Seed Stage Track at Venture Summit Virtual Connect 2021 being held December 7th – 9th 2021.
We will provide updates here when we have exact time slots for our presentation. If you're interested in attending the virtual event, reach out to invest@maxwell-labs.com
We will provide updates here when we have exact time slots for our presentation. If you're interested in attending the virtual event, reach out to invest@maxwell-labs.com
Maxwell Labs joins MLPerf & MLCommons
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MLPerf is a community-driven benchmark suite aimed to characterize machine learning application performance across a diverse set of system architectures - from mobile devices to supercomputers. Various working groups have helped MLPerf become the leader in AI benchmarking, and Maxwell Labs is excited to have the opportunity to participate!
Find out more at mlcommons.org/en ! |
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Maxwell Labs Selected for mHUB Accelerator
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We’re excited to announce that Maxwell Labs will be participating in the mHUBChicago IIoT accelerator program as part of their inaugural cohort focused on #IIoT. The mHUB program provides access to capital, mentorship, prototyping equipment and a regional supplier network, making hard to access resources available to hardtech entrepreneurs. Maxwell Labs is one of nine companies heading to Chicago for a 6-month deep dive into hands-on product development and we can’t wait to get started.
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Thermal Limits Reimagined
Maxwell Labs produces state-of-the-art thermal management and cryogenic cooling solutions aimed at taking high-performance computing, discovery and energy storage to the bleeding edge of what is possible.
Through a combination of novel materials, applied machine learning and embedded device design, Maxwell Labs is working around the clock to revolutionize the technologies that will open the door to a new generation of computing systems - meaning faster material design and discovery, more efficient datacenters, and unprecedented solid-state cooling capability.
Through a combination of novel materials, applied machine learning and embedded device design, Maxwell Labs is working around the clock to revolutionize the technologies that will open the door to a new generation of computing systems - meaning faster material design and discovery, more efficient datacenters, and unprecedented solid-state cooling capability.
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