Novel Passive-Cooling & Heat-Routing Devices
No Power, No Problem
Heat-Sink Topology Evolved
Advanced materials enable unprecedented energy transfer via radiation.
Finely tuned coatings for surfaces enable entirely new applications.
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Evolutionary approaches to the design of materials and heat-sink topology has resulted in surprising and novel solutions for energy transfer systems. Maxwell Labs has optimized these approaches around tightly-coupled layers of convective, conductive and radiative materials.
These solutions are completely passive, meaning they do not require external power sources. They can be combined with Active-Cooling layers, such as thermoelectric coolers (Peltier Coolers) to provide thermal-reservoirs and high-performance heat-pumping capabilities.
These solutions are completely passive, meaning they do not require external power sources. They can be combined with Active-Cooling layers, such as thermoelectric coolers (Peltier Coolers) to provide thermal-reservoirs and high-performance heat-pumping capabilities.