No Power, No Problem

Heat-Sink Topology Evolved

Advanced materials enable unprecedented energy transfer via radiation.

---

Finely tuned coatings for surfaces enable entirely new applications.

---

Evolutionary approaches to the design of materials and heat-sink topology has resulted in surprising and novel solutions for energy transfer systems. Maxwell Labs has optimized these approaches around tightly-coupled layers of convective, conductive and radiative materials.  

These solutions are completely passive, meaning they do not require external power sources. They can be combined with Active-Cooling layers, such as thermoelectric coolers (Peltier Coolers) to provide thermal-reservoirs and high-performance heat-pumping capabilities.