State-of-the-art Thermal Interface Material
Maxwell Labs' patented Radiative Thermal Compounds maximize the rate of heat transfer between a heat source and the cooling system by optimizing materials for kinetic and radiative thermal transfer.
Next-Gen MaterialsAI-driven materials science to maximize performance while lowering processor temperatures
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Zero Pump-OutState-of-the-art pump-out characteristics for tomorrow's High-Performance Compute hardware
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Maximum CoolingHighest-end thermal conductivity available for industrial compute and edge applications
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