State-of-the-art Thermal Interface Material

Maxwell Labs' patented Radiative Thermal Compounds maximize the rate of heat transfer between a heat source and the cooling system by optimizing materials for kinetic and radiative thermal transfer. 

Next-Gen Materials

AI-driven materials science to maximize performance while lowering processor temperatures

Zero Pump-Out

State-of-the-art pump-out characteristics for tomorrow's High-Performance Compute hardware

Maximum Cooling

Highest-end thermal conductivity available for industrial compute and edge applications